Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459778 | Chip on board leadframe for semiconductor components having area array | Dalson Ye Seng Kim, Lee Choon Kuan | 2008-12-02 |
| 7116122 | Method for ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2006-10-03 |
| 7049173 | Method for fabricating semiconductor component with chip on board leadframe | Dalson Ye Seng Kim, Lee Choon Kuan | 2006-05-23 |
| 6903449 | Semiconductor component having chip on board leadframe | Dalson Ye Seng Kim, Lee Choon Kuan | 2005-06-07 |
| 6847220 | Method for ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2005-01-25 |
| 6740983 | Method for ball grind array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-05-25 |
| 6740984 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-05-25 |
| 6693363 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-02-17 |
| 6674175 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2004-01-06 |
| 6600335 | Method for ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2003-07-29 |
| 6522019 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2003-02-18 |
| 6522018 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2003-02-18 |
| 6448664 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2002-09-10 |
| 6420789 | Ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2002-07-16 |