Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8444044 | Apparatus and methods for forming wire bonds | Mitchell T. Ong, Lee Choon Kuan | 2013-05-21 |
| 7906853 | Package structure for multiple die stack | — | 2011-03-15 |
LW
Low Peng Wang
Overall (All Time): #2,071,877 of 4,157,543Top 50%
2
Patents All Time