Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617201 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Lee Choon Kuan, Tim Teoh, Patrick Guay, Choong L. Wah | 2003-09-09 |
| 6468831 | Method of fabricating thin integrated circuit units | Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Boon Pew Chan | 2002-10-22 |
| 6274929 | Stacked double sided integrated circuit package | Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Boon Pew Chan | 2001-08-14 |
| 6218202 | Semiconductor device testing and burn-in methodology | Chee Kiang Yew, Kim Hoch Tey, Min Yu Chan | 2001-04-17 |