Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468831 | Method of fabricating thin integrated circuit units | Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Jeffrey Toh, Boon Pew Chan | 2002-10-22 |
| 6274929 | Stacked double sided integrated circuit package | Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Jeffrey Toh, Boon Pew Chan | 2001-08-14 |
| 6091140 | Thin chip-size integrated circuit package | Tuck Fook Toh, Chee Kiang Yew, Pang Hup Ong | 2000-07-18 |