Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6387729 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more | 2002-05-14 |
| 6365833 | Integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more | 2002-04-02 |
| 6091140 | Thin chip-size integrated circuit package | Chew Weng Leong, Chee Kiang Yew, Pang Hup Ong | 2000-07-18 |
| 6087203 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more | 2000-07-11 |