Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8592258 | Semiconductor package and method of attaching semiconductor dies to substrates | Denver Paul C. Castillo, Bryan Tan, Rodel Manalac, Kian Teng Eng, Soo Pin Chow +3 more | 2013-11-26 |
| 8247272 | Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process | Yong Chuan Koh, Jimmy SIAT, Jeffrey Nantes Salamat, Lope Vallespin Pepito, Jr., Ronaldo Cayetano Calderon +2 more | 2012-08-21 |
| 6768646 | High density internal ball grid array integrated circuit package | Fung Leng Chen, Chee Kiang Yew | 2004-07-27 |
| 6468831 | Method of fabricating thin integrated circuit units | Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Jeffrey Toh, Boon Pew Chan | 2002-10-22 |
| 6274929 | Stacked double sided integrated circuit package | Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Jeffrey Toh, Boon Pew Chan | 2001-08-14 |
| 6091140 | Thin chip-size integrated circuit package | Tuck Fook Toh, Chew Weng Leong, Chee Kiang Yew | 2000-07-18 |
| 6049129 | Chip size integrated circuit package | Chee Kiang Yew, Yong Khim Swee, Min Yu Chan, Anthony L. Coyle | 2000-04-11 |