Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8592258 | Semiconductor package and method of attaching semiconductor dies to substrates | Bryan Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong, Soo Pin Chow +3 more | 2013-11-26 |