Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8592258 | Semiconductor package and method of attaching semiconductor dies to substrates | Denver Paul C. Castillo, Bryan Tan, Kian Teng Eng, Pang Hup Ong, Soo Pin Chow +3 more | 2013-11-26 |
| 8247272 | Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process | Yong Chuan Koh, Jimmy SIAT, Jeffrey Nantes Salamat, Lope Vallespin Pepito, Jr., Ronaldo Cayetano Calderon +2 more | 2012-08-21 |
| 7109570 | Integrated circuit package with leadframe enhancement and method of manufacturing the same | Hien Boon Tan, Francis Poh, Jaime Siat, Roland Cordero | 2006-09-19 |