Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842792 | Method of producing a semiconductor package | Danny Retuta, Anthony Yi Sheng Sun, Mary Annie Cheong | 2017-12-12 |
| 9281218 | Method of producing a semiconductor package | Danny Retuta, Anthony Yi Sheng Sun, Mary Annie Cheong | 2016-03-08 |
| 8129222 | High density chip scale leadframe package and method of manufacturing the package | Anthony Yi Sheng Sun | 2012-03-06 |
| 8039951 | Thermally enhanced semiconductor package and method of producing the same | Kolan Ravi Kanth, Danny Retuta, Anthony Sun-Yi Sheng, Susanto Tanary, Patrick Low Tse Hoong | 2011-10-18 |
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Roel Adeva Robles, Danny Retuta, Mary Annie Cheong, Anthony Yi Sheng Sun, Richard Te Gan | 2011-10-04 |
| 7830006 | Structurally-enhanced integrated circuit package and method of manufacture | Ravi Kanth Kolan, Anthony Yi Sheng Sun, Beng Kuan Lim, Krishnamoorthi Sivalingam | 2010-11-09 |
| 7816775 | Multi-die IC package and manufacturing method | Chuen Khiang Wang, Hao Liu, Clifton Teik Lyk Law, Rahamat Bidin, Anthony Yi Sheng Sun | 2010-10-19 |
| 7723833 | Stacked die packages | Gaurav Mehta, Susanto Tanary, Mary Annie Cheong, Anthony Yi Sheng Sun, Chuen Khiang Wang | 2010-05-25 |
| 7678610 | Semiconductor chip package and method of manufacture | Chuen Khiang Wang, Anthony Yi Sheng Sun, Sin Nee Song, Steven Yu Feng Yao, Hua Tan | 2010-03-16 |
| 7476569 | Leadframe enhancement and method of producing a multi-row semiconductor package | Danny Retuta, Susanto Tanary, Anthony Yi Sheng Sun, Soon Huat Tan | 2009-01-13 |
| 7375416 | Leadframe enhancement and method of producing a multi-row semiconductor package | Danny Retuta, Susanto Tanary, Anthony Yi Sheng Sun, Soon Huat Tan | 2008-05-20 |
| 7345357 | High density chip scale leadframe package and method of manufacturing the package | Anthony Yi Sheng Sun | 2008-03-18 |
| 7339278 | Cavity chip package | Henry Iksan, Seong Kwang Kim, Susanto Tanary, Yi-Sheng Anthony Sun | 2008-03-04 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package | Anthony Yi Sheng Sun, Francis Poh | 2008-01-29 |
| 7109570 | Integrated circuit package with leadframe enhancement and method of manufacturing the same | Rodel Manalac, Francis Poh, Jaime Siat, Roland Cordero | 2006-09-19 |
| 6876069 | Ground plane for exposed package | Jefferey D. Punzalan, Zheng Zheng, Jae Hak Yee, Byung Joon Han | 2005-04-05 |
| 6630373 | Ground plane for exposed package | Jeffrey D. Punzalan, Zheng Zheng, Jae Hak Yee, Byung Joon Han | 2003-10-07 |
| 6420779 | Leadframe based chip scale package and method of producing the same | Nirmal Sharma, Rahamat Bidin | 2002-07-16 |