Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8544755 | Subscriber identity module (SIM) card | Hao Liu | 2013-10-01 |
| 7816775 | Multi-die IC package and manufacturing method | Chuen Khiang Wang, Hao Liu, Hien Boon Tan, Clifton Teik Lyk Law, Anthony Yi Sheng Sun | 2010-10-19 |
| 6420779 | Leadframe based chip scale package and method of producing the same | Nirmal Sharma, Hien Boon Tan | 2002-07-16 |