Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816775 | Multi-die IC package and manufacturing method | Chuen Khiang Wang, Hao Liu, Hien Boon Tan, Rahamat Bidin, Anthony Yi Sheng Sun | 2010-10-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816775 | Multi-die IC package and manufacturing method | Chuen Khiang Wang, Hao Liu, Hien Boon Tan, Rahamat Bidin, Anthony Yi Sheng Sun | 2010-10-19 |