Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881863 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2018-01-30 |
| 9589875 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2017-03-07 |
| 9391026 | Semiconductor packages and methods of packaging semiconductor devices | — | 2016-07-12 |
| 9136142 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2015-09-15 |
| 8916422 | Semiconductor packages and methods of packaging semiconductor devices | — | 2014-12-23 |
| 8860079 | Semiconductor packages and methods of packaging semiconductor devices | Catherine Bee Liang Ng, Kriangsak Sae Le, Nathapong Suthiwongsunthorn | 2014-10-14 |
| 8829666 | Semiconductor packages and methods of packaging semiconductor devices | Catherine Bee Liang Ng, Kriangsak Sae Le, Nathapong Suthiwongsunthorn | 2014-09-09 |
| 8716873 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2014-05-06 |
| 7816775 | Multi-die IC package and manufacturing method | Hao Liu, Hien Boon Tan, Clifton Teik Lyk Law, Rahamat Bidin, Anthony Yi Sheng Sun | 2010-10-19 |
| 7723833 | Stacked die packages | Gaurav Mehta, Hien Boon Tan, Susanto Tanary, Mary Annie Cheong, Anthony Yi Sheng Sun | 2010-05-25 |
| 7678610 | Semiconductor chip package and method of manufacture | Hien Boon Tan, Anthony Yi Sheng Sun, Sin Nee Song, Steven Yu Feng Yao, Hua Tan | 2010-03-16 |