Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818556 | Method for forming a semiconductor structure | Jia Fang, Yu-Hsiang Lin, Ching-Hsiang Chiu, Chia-Wei Liu | 2020-10-27 |
| 9524967 | Semiconductor device and method of forming the same | Chien-Ming Lai, Yu-Ping Wang, Mon-Sen Lin, Ya-Huei Tsai, Ching-Hsiang Chiu | 2016-12-20 |
| 9379242 | Method of fabricating fin field effect transistor | Mon-Sen Lin, Yu-Ping Wang, Yu-Ting Tseng, Chun-Tsen Lu | 2016-06-28 |
| 8741762 | Through silicon via dies and packages | Yi-Sheng Anthony Sun, Ravi Kanth Kolan, Chin Hock Toh | 2014-06-03 |
| 8586465 | Through silicon via dies and packages | Yi-Sheng Anthony Sun, Ravi Kanth Kolan, Chin Hock Toh | 2013-11-19 |
| 8544755 | Subscriber identity module (SIM) card | Rahamat Bidin | 2013-10-01 |
| 8426246 | Vented die and package | Chin Hock Toh, Ravi Kanth Kolan | 2013-04-23 |
| 8399985 | Mold design and semiconductor package | Ravi Kanth Kolan, Chin Hock Toh | 2013-03-19 |
| 8143719 | Vented die and package | Chin Hock Toh, Ravi Kanth Kolan | 2012-03-27 |
| 8030761 | Mold design and semiconductor package | Ravi Kanth Kolan, Chin Hock Toh | 2011-10-04 |
| 7816775 | Multi-die IC package and manufacturing method | Chuen Khiang Wang, Hien Boon Tan, Clifton Teik Lyk Law, Rahamat Bidin, Anthony Yi Sheng Sun | 2010-10-19 |