Issued Patents All Time
Showing 1–25 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12415718 | Impact-resistant micromechanical arms | Jheng-Hong Jiang, Shing-Huang Wu | 2025-09-16 |
| 12400947 | Variable graduated capacitor structure and methods for forming the same | Jheng-Hong Jiang, Shing-Huang Wu | 2025-08-26 |
| 12396179 | Resistive random access memory device | Jheng-Hong Jiang, Cheung Cheng | 2025-08-19 |
| 12368349 | Composite two-phase fluid cooling motor and composite two-phase fluid cooling device thereof | Kwun-Yao Ho, Szu-Hsien Liu, Yao-Ching Huang | 2025-07-22 |
| 12261129 | Damping device and method of making | Jheng-Hong Jiang, Shing-Huang Wu | 2025-03-25 |
| 12243839 | Bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chung-Sung Chiang, Yu-Ruei Chen, Yu-Hsiang Lin | 2025-03-04 |
| 12239034 | Resistive random access memory device having needle-like-shaped top electrode region and method for fabricating the same | Jheng-Hong Jiang, Shing-Huang Wu | 2025-02-25 |
| 12237280 | Cavity resonator for enhancing radio-frequency performance and methods for forming the same | Jheng-Hong Jiang, Shing-Huang Wu | 2025-02-25 |
| 12205901 | Plasma-damage-resistant interconnect structure and methods for forming the same | Jheng-Hong Jiang, Shing-Huang Wu | 2025-01-21 |
| 12191247 | Variable graduated capacitor structure and methods for forming the same | Jheng-Hong Jiang, Shing-Huang Wu | 2025-01-07 |
| 12178136 | Semiconductor device and method for fabricating the same | Jia Fang, Chun-Hsien Lin | 2024-12-24 |
| 12165868 | Semiconductor device in a containment structure including a buried layer | Hung-Te Lin, Hung-Chih Yu | 2024-12-10 |
| 12131915 | Pit-less chemical mechanical planarization process and device structures made therefrom | Jheng-Hong Jiang, Shing-Huang Wu | 2024-10-29 |
| 12027431 | Semiconductor structure and method of making | Jheng-Hong Jiang, Shing-Huang Wu | 2024-07-02 |
| 11950433 | Resistive random access memory device | Jheng-Hong Jiang, Cheung Cheng | 2024-04-02 |
| 11935854 | Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chung-Sung Chiang, Yu-Ruei Chen, Yu-Hsiang Lin | 2024-03-19 |
| 11914915 | Near eye display apparatus | Jheng-Hong Jiang, Shing-Huang Wu | 2024-02-27 |
| 11892639 | Display device having display area with luminous pixels over curved surface of semiconductor substrate for use in near-eye display | Jheng-Hong Jiang, Shing-Huang Wu | 2024-02-06 |
| 11848291 | Cavity resonator for enhancing radio-frequency performance and methods for forming the same | Jheng-Hong Jiang, Shing-Huang Wu | 2023-12-19 |
| 11772962 | MEMS package and forming method thereof | Chung-Nang Chen, Shing-Huang Wu | 2023-10-03 |
| 11778917 | Semiconductor device and method for fabricating the same | Jia Fang, Chun-Hsien Lin | 2023-10-03 |
| 11728272 | Plasma-damage-resistant interconnect structure and methods for manufacturing the same | Jheng-Hong Jiang, Shing-Huang Wu | 2023-08-15 |
| 11710632 | Method of manufacturing at least one semiconductor device on or in a base semiconductor material disposed in a containment structure including a buried layer | Hung-Te Lin, Hung-Chih Yu | 2023-07-25 |
| 11705340 | Pit-less chemical mechanical planarization process and device structures made therefrom | Jheng-Hong Jiang, Shing-Huang Wu | 2023-07-18 |
| 11678592 | Step height mitigation in resistive random access memory structures | Wei-Ming Wang, Jen-Sheng Yang, Wen-Ting Chu, Yu-Wen Liao, Huei-Tzu Wang | 2023-06-13 |