Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368349 | Composite two-phase fluid cooling motor and composite two-phase fluid cooling device thereof | Szu-Hsien Liu, Yao-Ching Huang, Chia-Wei Liu | 2025-07-22 |
| 11997793 | Optical unit | Shinri Ono, Tomohiro Egawa, Genki TANAKA, Soichiro Kimura, Tsungting Hsieh | 2024-05-28 |
| 11627663 | Optical unit | Soichiro Kimura, Tomohiro Egawa, Genki TANAKA, Shinri Ono, Tsungting Hsieh +3 more | 2023-04-11 |
| 8269329 | Multi-chip package | Moriss Kung | 2012-09-18 |
| 7638881 | Chip package | Chia-Jung Chang, Moriss Kung | 2009-12-29 |
| 7622326 | Manufacturing process of a chip package structure | Moriss Kung | 2009-11-24 |
| 7504726 | Chip and manufacturing method and application thereof | Moriss Kung, Wen-Yuan Chang, Hsueh-Chung Shelton Lu | 2009-03-17 |
| 7470864 | Multi-conducting through hole structure | Moriss Kung, Chi-Hsing Hsu, Jimmy Hsu | 2008-12-30 |
| 7382049 | Chip package and bump connecting structure thereof | Moriss Kung | 2008-06-03 |
| 7342317 | Low coefficient of thermal expansion build-up layer packaging and method thereof | Moriss Kung | 2008-03-11 |
| 7247951 | Chip carrier with oxidation protection layer | Moriss Kung | 2007-07-24 |
| 7235429 | Conductive block mounting process for electrical connection | Moriss Kung | 2007-06-26 |
| 7180166 | Stacked multi-chip package | Moriss Kung | 2007-02-20 |
| 7176559 | Integrated circuit package with a balanced-part structure | Moriss Kung, Terry Ku, Andy Liao | 2007-02-13 |
| 7173341 | High performance thermally enhanced package and method of fabricating the same | Moriss Kung | 2007-02-06 |
| 7071569 | Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection | Moriss Kung | 2006-07-04 |
| 7033917 | Packaging substrate without plating bar and a method of forming the same | Moriss Kung | 2006-04-25 |
| 6981320 | Circuit board and fabricating process thereof | Moriss Kung | 2006-01-03 |
| 6977348 | High density laminated substrate structure and manufacture method thereof | Chen-Yueh Kung | 2005-12-20 |
| 6972964 | Module board having embedded chips and components and method of forming the same | Moriss Kung | 2005-12-06 |
| 6960826 | Multi-chip package and manufacturing method thereof | Moriss Kung | 2005-11-01 |
| 6946727 | Vertical routing structure | Moriss Kung | 2005-09-20 |
| 6929488 | Electrical connection device between a pin-typed IC package and a circuit board | Moriss Kung | 2005-08-16 |
| 6916687 | Bump process for flip chip package | Moriss Kung | 2005-07-12 |
| 6913814 | Lamination process and structure of high layout density substrate | Moriss Kung | 2005-07-05 |