Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227848 | Chip package array, and chip package | Wei-Cheng Chen, Hsueh-Chung Shelton Lu | 2022-01-18 |
| 11081371 | Chip package process | Wei-Cheng Chen, Hsueh-Chung Shelton Lu | 2021-08-03 |
| 10756077 | Chip packaging method | Yeh Hsu, Hsueh-Chung Shelton Lu, Wei-Cheng Chen | 2020-08-25 |
| 10504847 | Chip package structure and chip package structure array | Yeh Hsu, Hsueh-Chung Shelton Lu, Wei-Cheng Chen | 2019-12-10 |
| 10459007 | Probe card | Chen-Yueh Kung, Wei-Cheng Chen | 2019-10-29 |
| 10184956 | Probe card | Chen-Yueh Kung, Wei-Cheng Chen | 2019-01-22 |
| 10119995 | Probe card | Chen-Yueh Kung, Wei-Cheng Chen | 2018-11-06 |
| 10002839 | Electronic structure, and electronic structure array | Wei-Cheng Chen, Chen-Yueh Kung | 2018-06-19 |
| 9905519 | Electronic structure process | Wei-Cheng Chen, Chen-Yueh Kung | 2018-02-27 |
| 9788425 | Electronic package assembly | Nai-Shung Chang, Kuo-Ying Tsai | 2017-10-10 |
| 9425066 | Circuit substrate | Chen-Yueh Kung | 2016-08-23 |
| 9418964 | Chip package structure | Yeh Hsu, Wei-Chih Lai | 2016-08-16 |
| 9324580 | Process for fabricating a circuit substrate | Chen-Yueh Kung | 2016-04-26 |
| 8796848 | Circuit board and chip package structure | Wei-Cheng Chen, Yeh Hsu | 2014-08-05 |
| 8698325 | Integrated circuit package and physical layer interface arrangement | Yu-Kai Chen, Yeh Hsu, Ying-Ni Lee, Wei-Chih Lai | 2014-04-15 |
| 8602207 | Conveyor-belt linking apparatus of metallurgical furnace | — | 2013-12-10 |
| 8508024 | Chip package structure and package substrate | — | 2013-08-13 |
| RE42710 | Apparatus compensating a scanned object for optical characteristics according to light sources of different wavelengths | — | 2011-09-20 |
| 7906377 | Fabrication method of circuit board | Wei-Cheng Chen, Yeh Hsu | 2011-03-15 |
| 7868439 | Chip package and substrate thereof | Chih-An Yang | 2011-01-11 |
| 7609524 | Package structure for panel module and method using the same | Chung-Kuan Ting, Shih-Chi Chen, Chia-Chung WU | 2009-10-27 |
| 7586188 | Chip package and coreless package substrate thereof | — | 2009-09-08 |
| 7579612 | Resistive memory device having enhanced resist ratio and method of manufacturing same | Denny Tang, Tai-Bor Wu, Tzyh-Cheang Lee | 2009-08-25 |
| 7504726 | Chip and manufacturing method and application thereof | Kwun-Yao Ho, Moriss Kung, Hsueh-Chung Shelton Lu | 2009-03-17 |
| 7505181 | Operating method and changer for optical module/printer module system | Chih-Wen Huang | 2009-03-17 |