YH

Yeh Hsu

TSMC: 13 patents #2,298 of 12,232Top 20%
VT Via Technologies: 5 patents #137 of 1,108Top 15%
SC Shanghai Zhaoxin Semiconductor Co.: 2 patents #64 of 177Top 40%
VC Via Alliance Semiconductor Co.: 2 patents #58 of 157Top 40%
Overall (All Time): #195,357 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #TitleCo-InventorsDate
10756077 Chip packaging method Wen-Yuan Chang, Hsueh-Chung Shelton Lu, Wei-Cheng Chen 2020-08-25
10734503 Asymmetric semiconductor device Jean-Pierre Colinge, Carlos H. Diaz, Tsung-Hsing Yu, Chia-Wen Liu 2020-08-04
10504847 Chip package structure and chip package structure array Wen-Yuan Chang, Hsueh-Chung Shelton Lu, Wei-Cheng Chen 2019-12-10
10276664 Semiconductor structures and methods for multi-dimension of nanowire diameter to improve drive current Tsung-Hsing Yu, Chia-Wen Liu, Jean-Pierre Colinge 2019-04-30
10204852 Circuit substrate and semiconductor package structure Chen-Yueh Kung 2019-02-12
10026826 Method of forming semiconductor device having gate dielectric surrounding at least some of channel region and gate electrode surrounding at least some of gate dielectric Jean-Pierre Colinge, Carlos H. Diaz, Tsung-Hsing Yu, Chia-Wen Liu 2018-07-17
9768297 Process design to improve transistor variations and performance Tsung-Hsing Yu, Chia-Wen Liu, Shih-Syuan Huang, Ken-Ichi Goto, Zhiqiang Wu 2017-09-19
9728602 Variable channel strain of nanowire transistors to improve drive current Tsung-Hsing Yu, Chia-Wen Liu, Jean-Pierre Colinge 2017-08-08
9716172 Semiconductor device having multiple active area layers and its formation thereof Tsung-Hsing Yu, Chia-Wen Liu, Ken-Ichi Goto 2017-07-25
9634132 Semiconductor structures and methods for multi-level band gap energy of nanowire transistors to improve drive current Tsung-Hsing Yu, Chia-Wen Liu, Jean-Pierre Colinge 2017-04-25
9620591 Semiconductor structures and methods for multi-level work function and multi-valued channel doping of nanowire transistors to improve drive current Tsung-Hsing Yu, Chia-Wen Liu, Jean-Pierre Colinge 2017-04-11
9601425 Circuit substrate and semiconductor package structure Chen-Yueh Kung 2017-03-21
9536746 Recess and epitaxial layer to improve transistor performance Chia-Wen Liu, Tsung-Hsing Yu, Ken-Ichi Goto, Shih-Syuan Huang 2017-01-03
9525031 Epitaxial channel Tsung-Hsing Yu, Ken-Ichi Goto, Chia-Wen Liu 2016-12-20
9484460 Semiconductor device having gate dielectric surrounding at least some of channel region and gate electrode surrounding at least some of gate dielectric Jean-Pierre Colinge, Tsung-Hsing Yu, Chia-Wen Liu, Carlos H. Diaz 2016-11-01
9418964 Chip package structure Wen-Yuan Chang, Wei-Chih Lai 2016-08-16
9224814 Process design to improve transistor variations and performance Tsung-Hsing Yu, Chia-Wen Liu, Shih-Syuan Huang, Ken-Ichi Goto, Zhiqiang Wu 2015-12-29
9196730 Variable channel strain of nanowire transistors to improve drive current Tsung-Hsing Yu, Chia-Wen Liu, Jean-Pierre Colinge 2015-11-24
8796848 Circuit board and chip package structure Wen-Yuan Chang, Wei-Cheng Chen 2014-08-05
8736079 Pad structure, circuit carrier and integrated circuit chip Yu-Kai Chen 2014-05-27
8698325 Integrated circuit package and physical layer interface arrangement Wen-Yuan Chang, Yu-Kai Chen, Ying-Ni Lee, Wei-Chih Lai 2014-04-15
7906377 Fabrication method of circuit board Wen-Yuan Chang, Wei-Cheng Chen 2011-03-15