Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8698325 | Integrated circuit package and physical layer interface arrangement | Wen-Yuan Chang, Yu-Kai Chen, Yeh Hsu, Wei-Chih Lai | 2014-04-15 |
| 7615708 | Arrangement of non-signal through vias and wiring board applying the same | Hsing-Chou Hsu | 2009-11-10 |