Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227848 | Chip package array, and chip package | Wen-Yuan Chang, Wei-Cheng Chen | 2022-01-18 |
| 11081371 | Chip package process | Wen-Yuan Chang, Wei-Cheng Chen | 2021-08-03 |
| 10756077 | Chip packaging method | Wen-Yuan Chang, Yeh Hsu, Wei-Cheng Chen | 2020-08-25 |
| 10504847 | Chip package structure and chip package structure array | Wen-Yuan Chang, Yeh Hsu, Wei-Cheng Chen | 2019-12-10 |
| 7504726 | Chip and manufacturing method and application thereof | Kwun-Yao Ho, Moriss Kung, Wen-Yuan Chang | 2009-03-17 |
| 6741901 | System and method for coordinated inter-organizational information sharing | Mavis Liao, Irving Fan | 2004-05-25 |
| 6680544 | Flip-chip bump arrangement for decreasing impedance | Kenny Chang, Jimmy Huang | 2004-01-20 |