Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8269329 | Multi-chip package | Kwun-Yao Ho | 2012-09-18 |
| 7638881 | Chip package | Chia-Jung Chang, Kwun-Yao Ho | 2009-12-29 |
| 7622326 | Manufacturing process of a chip package structure | Kwun-Yao Ho | 2009-11-24 |
| 7504726 | Chip and manufacturing method and application thereof | Kwun-Yao Ho, Wen-Yuan Chang, Hsueh-Chung Shelton Lu | 2009-03-17 |
| 7470864 | Multi-conducting through hole structure | Kwun-Yao Ho, Chi-Hsing Hsu, Jimmy Hsu | 2008-12-30 |
| 7382049 | Chip package and bump connecting structure thereof | Kwun-Yao Ho | 2008-06-03 |
| 7342317 | Low coefficient of thermal expansion build-up layer packaging and method thereof | Kwun-Yao Ho | 2008-03-11 |
| 7247951 | Chip carrier with oxidation protection layer | Kwun-Yao Ho | 2007-07-24 |
| 7235429 | Conductive block mounting process for electrical connection | Kwun-Yao Ho | 2007-06-26 |
| 7180166 | Stacked multi-chip package | Kwun-Yao Ho | 2007-02-20 |
| 7176559 | Integrated circuit package with a balanced-part structure | Kwun-Yao Ho, Terry Ku, Andy Liao | 2007-02-13 |
| 7173341 | High performance thermally enhanced package and method of fabricating the same | Kwun-Yao Ho | 2007-02-06 |
| 7101781 | Integrated circuit packages without solder mask and method for the same | Kun-Yao Ho | 2006-09-05 |
| 7071569 | Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection | Kwun-Yao Ho | 2006-07-04 |
| 7033917 | Packaging substrate without plating bar and a method of forming the same | Kwun-Yao Ho | 2006-04-25 |
| 6981320 | Circuit board and fabricating process thereof | Kwun-Yao Ho | 2006-01-03 |
| 6972964 | Module board having embedded chips and components and method of forming the same | Kwun-Yao Ho | 2005-12-06 |
| 6960826 | Multi-chip package and manufacturing method thereof | Kwun-Yao Ho | 2005-11-01 |
| 6951773 | Chip packaging structure and manufacturing process thereof | Kwun-Yo Ho | 2005-10-04 |
| 6946727 | Vertical routing structure | Kwun-Yao Ho | 2005-09-20 |
| 6929488 | Electrical connection device between a pin-typed IC package and a circuit board | Kwun-Yao Ho | 2005-08-16 |
| 6916687 | Bump process for flip chip package | Kwun-Yao Ho | 2005-07-12 |
| 6913814 | Lamination process and structure of high layout density substrate | Kwun-Yao Ho | 2005-07-05 |
| 6902997 | Process of forming bonding columns | Kwun-Yao Ho | 2005-06-07 |
| 6896173 | Method of fabricating circuit substrate | Kwun-Yao Ho | 2005-05-24 |