KH

Kwun-Yo Ho

VT Via Technologies: 2 patents #343 of 1,108Top 35%
Overall (All Time): #2,184,086 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6951773 Chip packaging structure and manufacturing process thereof Moriss Kung 2005-10-04
6716692 Fabrication process and structure of laminated capacitor Moriss Kung 2004-04-06