Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9788425 | Electronic package assembly | Nai-Shung Chang, Wen-Yuan Chang | 2017-10-10 |
| 7477515 | Electronic apparatus and thermal dissipating module thereof | Shih-Chang Ku | 2009-01-13 |
| 6665933 | Process for fabricating heat sink with high-density fins | Chih-Jen Chen | 2003-12-23 |