Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7405103 | Process for fabricating chip embedded package structure | — | 2008-07-29 |
| 7372169 | Arrangement of conductive pads on grid array package and on circuit board | — | 2008-05-13 |
| 7342692 | Scanner carrier | — | 2008-03-11 |
| 7289250 | [Operating method and changer for optical module/printer module system] | Chih-Wen Huang | 2007-10-30 |
| 7253526 | Semiconductor packaging substrate and method of producing the same | Chi-Hsing Hsu | 2007-08-07 |
| 7225985 | Optical scanner | Jen-Shou Tseng | 2007-06-05 |
| 7225925 | Shock absorbent packaging structure | Chiu-Chun Chen, Bo-Chi Chou | 2007-06-05 |
| 7170162 | Chip embedded package structure | — | 2007-01-30 |
| 6946738 | Semiconductor packaging substrate and method of producing the same | Chi-Hsing Hsu | 2005-09-20 |
| 6947186 | Scanner carrier | — | 2005-09-20 |
| 6798075 | Grid array packaged integrated circuit | Yuang-Tsang Liaw, Hung-Yin Tsai | 2004-09-28 |
| 6650444 | Apparatus compensating a scanned object for optical characteristics according to light sources of different wavelengths | — | 2003-11-18 |
| 6586844 | Flip chip die | — | 2003-07-01 |
| 6515362 | Grid array package with increased electrical grounding routes and method of fabrication | — | 2003-02-04 |
| 6479891 | Incorrect-placement preventing directional IC tray for carrying IC packages | Ming-Ren Chi | 2002-11-12 |