Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243839 | Bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chia-Wei Liu, Yu-Ruei Chen, Yu-Hsiang Lin | 2025-03-04 |
| 11935854 | Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chia-Wei Liu, Yu-Ruei Chen, Yu-Hsiang Lin | 2024-03-19 |
| 11640949 | Bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chia-Wei Liu, Yu-Ruei Chen, Yu-Hsiang Lin | 2023-05-02 |
| 8916471 | Method for forming semiconductor structure having through silicon via for signal and shielding structure | Ching-Li Yang, Chien-Li Kuo, Yu-Han Tsai, Chun-Wei Kang | 2014-12-23 |