Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315827 | Semiconductor structure including seal ring structure | Hui-Lung Chou, Chih-Sheng Chang, Chien-Ting Lin | 2025-05-27 |
| 11916018 | Manufacturing method of connection structure of semiconductor device | Chen-Yi Weng, Shih-Che Huang, Chih-Sheng Chang | 2024-02-27 |
| 11664333 | Method of manufacturing die seal ring | Shih-Che Huang, Shih-Hsien Chen, Chih-Sheng Chang | 2023-05-30 |
| 10978391 | Connection structure of semiconductor device and manufacturing method thereof | Chen-Yi Weng, Shih-Che Huang, Chih-Sheng Chang | 2021-04-13 |
| 10892235 | Die seal ring and manufacturing method thereof | Shih-Che Huang, Shih-Hsien Chen, Chih-Sheng Chang | 2021-01-12 |
| 9773860 | Capacitor and method for fabricating the same | Yu-Tsung Lai, Yu-Cheng Tung, Shih-Che Huang, Chih-Sheng Chang | 2017-09-26 |
| 9312208 | Through silicon via structure | Hsin-Yu Chen, Home-Been Cheng, Yu-Han Tsai | 2016-04-12 |
| 9048246 | Die seal ring and method of forming the same | Ming-Te Wei, Po-Chao Tsao, Chien-Yang Chen, Hui-Ling Chen, Guan-Kai Huang | 2015-06-02 |
| 9012324 | Through silicon via process | Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Ching-Wei Hsu, Szu-Hao Lai +3 more | 2015-04-21 |
| 8916471 | Method for forming semiconductor structure having through silicon via for signal and shielding structure | Chien-Li Kuo, Chung-Sung Chiang, Yu-Han Tsai, Chun-Wei Kang | 2014-12-23 |
| 8900996 | Through silicon via structure and method of fabricating the same | Hsin-Yu Chen, Home-Been Cheng, Yu-Han Tsai | 2014-12-02 |
| 8884398 | Anti-fuse structure and programming method thereof | Chu-Fu Lin, Chien-Li Kuo | 2014-11-11 |
| 8841755 | Through silicon via and method of forming the same | Kuo-Hsiung Huang, Chun-Mao Chiou, Hsin-Yu Chen, Yu-Han Tsai, Home-Been Cheng | 2014-09-23 |
| 8691688 | Method of manufacturing semiconductor structure | Hsin-Yu Chen, Yu-Han Tsai, Chun-Ling Lin, Home-Been Cheng | 2014-04-08 |
| 8518823 | Through silicon via and method of forming the same | Kuo-Hsiung Huang, Chun-Mao Chiou, Hsin-Yu Chen, Yu-Han Tsai, Home-Been Cheng | 2013-08-27 |
| 7696606 | Metal structure | Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho | 2010-04-13 |
| 7649268 | Semiconductor wafer | Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho | 2010-01-19 |
| 7387950 | Method for forming a metal structure | Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho | 2008-06-17 |