| 12315827 |
Semiconductor structure including seal ring structure |
Hui-Lung Chou, Chih-Sheng Chang, Chien-Ting Lin |
2025-05-27 |
|
| 11916018 |
Manufacturing method of connection structure of semiconductor device |
Chen-Yi Weng, Shih-Che Huang, Chih-Sheng Chang |
2024-02-27 |
$603,000 |
| 11664333 |
Method of manufacturing die seal ring |
Shih-Che Huang, Shih-Hsien Chen, Chih-Sheng Chang |
2023-05-30 |
$708,000 |
| 10978391 |
Connection structure of semiconductor device and manufacturing method thereof |
Chen-Yi Weng, Shih-Che Huang, Chih-Sheng Chang |
2021-04-13 |
$1,335,000 |
| 10892235 |
Die seal ring and manufacturing method thereof |
Shih-Che Huang, Shih-Hsien Chen, Chih-Sheng Chang |
2021-01-12 |
$2,054,000 |
| 9773860 |
Capacitor and method for fabricating the same |
Yu-Tsung Lai, Yu-Cheng Tung, Shih-Che Huang, Chih-Sheng Chang |
2017-09-26 |
$175,000 |
| 9312208 |
Through silicon via structure |
Hsin-Yu Chen, Home-Been Cheng, Yu-Han Tsai |
2016-04-12 |
$171,000 |
| 9048246 |
Die seal ring and method of forming the same |
Ming-Te Wei, Po-Chao Tsao, Chien-Yang Chen, Hui-Ling Chen, Guan-Kai Huang |
2015-06-02 |
$373,000 |
| 9012324 |
Through silicon via process |
Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Ching-Wei Hsu, Szu-Hao Lai +3 more |
2015-04-21 |
$303,000 |
| 8916471 |
Method for forming semiconductor structure having through silicon via for signal and shielding structure |
Chien-Li Kuo, Chung-Sung Chiang, Yu-Han Tsai, Chun-Wei Kang |
2014-12-23 |
$567,000 |
| 8900996 |
Through silicon via structure and method of fabricating the same |
Hsin-Yu Chen, Home-Been Cheng, Yu-Han Tsai |
2014-12-02 |
$1,072,000 |
| 8884398 |
Anti-fuse structure and programming method thereof |
Chu-Fu Lin, Chien-Li Kuo |
2014-11-11 |
$162,000 |
| 8841755 |
Through silicon via and method of forming the same |
Kuo-Hsiung Huang, Chun-Mao Chiou, Hsin-Yu Chen, Yu-Han Tsai, Home-Been Cheng |
2014-09-23 |
$401,000 |
| 8691688 |
Method of manufacturing semiconductor structure |
Hsin-Yu Chen, Yu-Han Tsai, Chun-Ling Lin, Home-Been Cheng |
2014-04-08 |
$208,000 |
| 8518823 |
Through silicon via and method of forming the same |
Kuo-Hsiung Huang, Chun-Mao Chiou, Hsin-Yu Chen, Yu-Han Tsai, Home-Been Cheng |
2013-08-27 |
$397,000 |
| 7696606 |
Metal structure |
Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho |
2010-04-13 |
$2,690,000 |
| 7649268 |
Semiconductor wafer |
Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho |
2010-01-19 |
$2,673,000 |
| 7387950 |
Method for forming a metal structure |
Chien-Li Kuo, Ping-Chang Wu, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho |
2008-06-17 |
$1,665,000 |