CH

Ching-Wei Hsu

Foxconn: 4 patents #1,314 of 5,504Top 25%
UM United Microelectronics: 3 patents #1,523 of 4,560Top 35%
Overall (All Time): #736,101 of 4,157,543Top 20%
7
Patents All Time

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
9412653 Through silicon via (TSV) process Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai +2 more 2016-08-09
9136170 Through silicon via (TSV) structure and process thereof Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai +2 more 2015-09-15
9012324 Through silicon via process Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Szu-Hao Lai, Huei-Ru Tsai +3 more 2015-04-21
8264831 Mounting apparatus for PCI card Chung-Cheng Hsieh, Li-Ping Chen 2012-09-11
8254145 Electronic device with expansion card modules Chung-Cheng Hsieh, Li-Ping Chen 2012-08-28
7990721 Computer system with heat sink Chung-Cheng Hsieh, Li-Ping Chen 2011-08-02
7990733 Mounting apparatus for PCI card Chung-Cheng Hsieh, Li-Ping Chen 2011-08-02