Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412653 | Through silicon via (TSV) process | Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu +2 more | 2016-08-09 |
| 9136170 | Through silicon via (TSV) structure and process thereof | Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu +2 more | 2015-09-15 |
| 9012324 | Through silicon via process | Chi-Mao Hsu, Tsun-Min Cheng, Ching-Wei Hsu, Szu-Hao Lai, Huei-Ru Tsai +3 more | 2015-04-21 |