JJ

Jui-Meng Jao

UM United Microelectronics: 11 patents #537 of 4,560Top 15%
SC Siliconware Precision Industries Co.: 6 patents #106 of 527Top 25%
Overall (All Time): #277,684 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8357988 Die seal ring Cheng-Chou Hung, Victor Chiang Liang, Cheng-Hung Li, Sheng-Yi Huang, Tzung-Lin Li +2 more 2013-01-22
8022509 Crack stopping structure and method for fabricating the same 2011-09-20
7696606 Metal structure Chien-Li Kuo, Ping-Chang Wu, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang 2010-04-13
7649268 Semiconductor wafer Chien-Li Kuo, Ping-Chang Wu, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang 2010-01-19
7518211 Chip and package structure 2009-04-14
7387950 Method for forming a metal structure Chien-Li Kuo, Ping-Chang Wu, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang 2008-06-17
7268440 Fabrication of semiconductor integrated circuit chips Zong-Huei Lin, Hung-Min Liu, Wen-Tung Chang, Kuo-Ming Chen, Kai-Kuang Ho 2007-09-11
7256475 On-chip test circuit for assessing chip integrity Chien-Li Kuo 2007-08-14
7250670 Semiconductor structure and fabricating method thereof Chien-Li Kuo, Bing Wu 2007-07-31
7176555 Flip chip package with reduced thermal stress Chien-Li Kuo 2007-02-13
7026234 Parasitic capacitance-preventing dummy solder bump structure and method of making the same Shing-Ren Sheu, Kuo-Ming Chen, Hung-Min Liu, Kun-Chih Wang 2006-04-11
6415974 Structure of solder bumps with improved coplanarity and method of forming solder bumps with improved coplanarity 2002-07-09
6391758 Method of forming solder areas over a lead frame Randy H. Y. Lo 2002-05-21
6348401 Method of fabricating solder bumps with high coplanarity for flip-chip application Chih-Shun Chen, Chao-Dung Suo, Ke Yang, Feng-Lung Chien 2002-02-19
6306682 Method of fabricating a ball grid array integrated circuit package having an encapsulating body Chien-Ping Huang, Randy H. Y. Lo, Tzong-Da Ho, Eric Ko 2001-10-23
6265763 Multi-chip integrated circuit package structure for central pad chip Eric Ko, Vicky Liu 2001-07-24
6249433 Heat-dissipating device for integrated circuit package Chien-Ping Huang 2001-06-19