| 6667546 |
Ball grid array semiconductor package and substrate without power ring or ground ring |
Chien-Ping Huang, Chih-Ming Huang |
2003-12-23 |
| 6555296 |
Fine pitch wafer bumping process |
Raymond Jao, Alex Yang |
2003-04-29 |
| 6427976 |
Lead-frame-based chip-scale package and method of manufacturing the same |
Chien-Ping Huang |
2002-08-06 |
| 6414385 |
Quad flat non-lead package of semiconductor |
Chien-Ping Huang |
2002-07-02 |
| 6306682 |
Method of fabricating a ball grid array integrated circuit package having an encapsulating body |
Chien-Ping Huang, Randy H. Y. Lo, Tzong-Da Ho, Jui-Meng Jao |
2001-10-23 |
| 6281578 |
Multi-chip module package structure |
Randy H. Y. Lo, Chi-Chuan Wu, Han-Ping Pu |
2001-08-28 |
| 6282094 |
Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same |
Randy H. Y. Lo, Jeng-Yuan Lai, Tzong-Da Ho |
2001-08-28 |
| 6265763 |
Multi-chip integrated circuit package structure for central pad chip |
Jui-Meng Jao, Vicky Liu |
2001-07-24 |
| 6246111 |
Universal lead frame type of quad flat non-lead package of semiconductor |
Chien-Ping Huang |
2001-06-12 |
| 6198171 |
Thermally enhanced quad flat non-lead package of semiconductor |
Chien-Ping Huang |
2001-03-06 |
| 6177892 |
EFM/DVD demodulator |
— |
2001-01-23 |
| 4695164 |
Position detector and mount therefor for a centrifugal analyzer |
Maury Zivitz, Mark Eslick |
1987-09-22 |
| 4398198 |
Pulse-hyperbolic location system using three passive beacon measurements |
Paul K. Dano |
1983-08-09 |