Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667546 | Ball grid array semiconductor package and substrate without power ring or ground ring | Chien-Ping Huang, Chih-Ming Huang | 2003-12-23 |
| 6555296 | Fine pitch wafer bumping process | Raymond Jao, Alex Yang | 2003-04-29 |
| 6427976 | Lead-frame-based chip-scale package and method of manufacturing the same | Chien-Ping Huang | 2002-08-06 |
| 6414385 | Quad flat non-lead package of semiconductor | Chien-Ping Huang | 2002-07-02 |
| 6306682 | Method of fabricating a ball grid array integrated circuit package having an encapsulating body | Chien-Ping Huang, Randy H. Y. Lo, Tzong-Da Ho, Jui-Meng Jao | 2001-10-23 |
| 6281578 | Multi-chip module package structure | Randy H. Y. Lo, Chi-Chuan Wu, Han-Ping Pu | 2001-08-28 |
| 6282094 | Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same | Randy H. Y. Lo, Jeng-Yuan Lai, Tzong-Da Ho | 2001-08-28 |
| 6265763 | Multi-chip integrated circuit package structure for central pad chip | Jui-Meng Jao, Vicky Liu | 2001-07-24 |
| 6246111 | Universal lead frame type of quad flat non-lead package of semiconductor | Chien-Ping Huang | 2001-06-12 |
| 6198171 | Thermally enhanced quad flat non-lead package of semiconductor | Chien-Ping Huang | 2001-03-06 |
| 6177892 | EFM/DVD demodulator | — | 2001-01-23 |
| 4695164 | Position detector and mount therefor for a centrifugal analyzer | Maury Zivitz, Mark Eslick | 1987-09-22 |
| 4398198 | Pulse-hyperbolic location system using three passive beacon measurements | Paul K. Dano | 1983-08-09 |