Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6770959 | Semiconductor package without substrate and method of manufacturing same | Chien-Ping Huang | 2004-08-03 |
| 6555296 | Fine pitch wafer bumping process | Eric Ko, Alex Yang | 2003-04-29 |
| 6114752 | Semiconductor package having lead frame with an exposed base pad | Chion-Ping Huang, Cheng-Yuan Lai | 2000-09-05 |