Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9223164 | Display | Hui Chen, Jung-An Cheng, Wei-Ho Ting, Yu Li, HongMei Zang +3 more | 2015-12-29 |
| 6716676 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Eing-Chieh Chen, Tzu-Yi Tien | 2004-04-06 |
| 6472741 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Eing-Chieh Chen, Tzu-Yi Tien | 2002-10-29 |
| 6462405 | Semiconductor package | Chien-Ping Huang | 2002-10-08 |
| 6400014 | Semiconductor package with a heat sink | Chien-Ping Huang, Tzu-Yi Tien, Chih-Ming Huang | 2002-06-04 |
| 6114752 | Semiconductor package having lead frame with an exposed base pad | Chion-Ping Huang, Raymond Jao | 2000-09-05 |