Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6716676 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Cheng-Yuan Lai, Tzu-Yi Tien | 2004-04-06 |
| 6650015 | Cavity-down ball grid array package with semiconductor chip solder ball | Shiu-Tai Tzung, Ting-Ke Chai, Jeng-Yuan Lai, Candy Tien | 2003-11-18 |
| 6472741 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Cheng-Yuan Lai, Tzu-Yi Tien | 2002-10-29 |