Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650015 | Cavity-down ball grid array package with semiconductor chip solder ball | Eing-Chieh Chen, Shiu-Tai Tzung, Ting-Ke Chai, Jeng-Yuan Lai | 2003-11-18 |
| 6552428 | Semiconductor package having an exposed heat spreader | Chien-Ping Huang, Tom Tang, Kevin Chiang, Jenq-Yuan Lai, Vicky Liu | 2003-04-22 |
| 6246115 | Semiconductor package having a heat sink with an exposed surface | Tom Tang, Chien-Ping Huang, Kevin Chiang, Jeng-Yuan Lai, Vicky Liu | 2001-06-12 |