Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650015 | Cavity-down ball grid array package with semiconductor chip solder ball | Eing-Chieh Chen, Shiu-Tai Tzung, Jeng-Yuan Lai, Candy Tien | 2003-11-18 |
| 6555924 | Semiconductor package with flash preventing mechanism and fabrication method thereof | Po Yuan, Han-Ping Pu | 2003-04-29 |
| 6359342 | Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same | Pao-Ho Yuan, Lien-Chi Chan, Jen-Yi Tsai | 2002-03-19 |