ST

Shiu-Tai Tzung

SC Siliconware Precision Industries Co.: 1 patents #303 of 527Top 60%
Overall (All Time): #3,528,877 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6650015 Cavity-down ball grid array package with semiconductor chip solder ball Eing-Chieh Chen, Ting-Ke Chai, Jeng-Yuan Lai, Candy Tien 2003-11-18