Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8304665 | Package substrate having landless conductive traces | Chiang-Cheng Chang, Yen-Ping Wang, Don-Son Jiang, Yu-Po Wang | 2012-11-06 |
| 8207620 | Flip-chip semiconductor package and chip carrier for preventing corner delamination | Yuan-Lin Tzeng, Nai-Hao Kao, Yu-Po Wang, Cheng-Hsu Hsiao | 2012-06-26 |
| 7364948 | Method for fabricating semiconductor package | Chun-Lung Chen | 2008-04-29 |
| 7199453 | Semiconductor package and fabrication method thereof | Chun-Lung Chen | 2007-04-03 |
| 7019389 | Lead frame and semiconductor package with the same | Yuan-Lin Tzeng, Ya-Yi Lai | 2006-03-28 |
| 6650015 | Cavity-down ball grid array package with semiconductor chip solder ball | Eing-Chieh Chen, Shiu-Tai Tzung, Ting-Ke Chai, Candy Tien | 2003-11-18 |
| 6501164 | Multi-chip semiconductor package with heat dissipating structure | Ying Chen, Jzu-Yi Tien, Chiung-Kai Yang | 2002-12-31 |
| 6369455 | Externally-embedded heat-dissipating device for ball grid array integrated circuit package | Tzong-Da Ho, Chien-Ping Huang | 2002-04-09 |
| 6323066 | Heat-dissipating structure for integrated circuit package | Chien-Ping Huang | 2001-11-27 |
| 6282094 | Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same | Randy H. Y. Lo, Eric Ko, Tzong-Da Ho | 2001-08-28 |
| 6246115 | Semiconductor package having a heat sink with an exposed surface | Tom Tang, Chien-Ping Huang, Kevin Chiang, Candy Tien, Vicky Liu | 2001-06-12 |
| 6236568 | Heat-dissipating structure for integrated circuit package | Chien-Ping Huang | 2001-05-22 |