Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049955 | Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer | Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu | 2018-08-14 |
| 9899237 | Carrier, semiconductor package and fabrication method thereof | Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu | 2018-02-20 |
| 9812340 | Method of fabricating semiconductor package having semiconductor element | Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu, Fu-Tang Huang | 2017-11-07 |
| 9324585 | Semiconductor package and method of fabricating the same | Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu, Fu-Tang Huang | 2016-04-26 |
| 9041189 | Semiconductor package and method of fabricating the same | Meng-Tsung Lee, Shih-Kuang Chiu | 2015-05-26 |
| 9040361 | Chip scale package with electronic component received in encapsulant, and fabrication method thereof | Chien-Ping Huang, Chun-Chi Ke, Hsin-Yi Liao, Hsi-Chang Hsu | 2015-05-26 |
| 8766456 | Method of fabricating a semiconductor package | Hsi-Chang Hsu, Hsin-Hung Chou, Hung-Wen Liu, Hsin-Yi Liao | 2014-07-01 |
| 8680692 | Carrier, semiconductor package and fabrication method thereof | Meng-Tsung Lee, Jung-Pang Huang, Shih-Kuang Chiu | 2014-03-25 |
| 8525348 | Chip scale package and fabrication method thereof | Chun-Chi Ke, Chien-Ping Huang | 2013-09-03 |
| 8334174 | Chip scale package and fabrication method thereof | Hsin-Yi Liao, Hsu-Hsi Chang, Shih-Kuang Chiu | 2012-12-18 |
| 8304665 | Package substrate having landless conductive traces | Yen-Ping Wang, Don-Son Jiang, Jeng-Yuan Lai, Yu-Po Wang | 2012-11-06 |