Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255165 | Electronic package and carrier thereof and method for manufacturing the same | Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Chang-Fu Lin | 2025-03-18 |
| 12255182 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin | 2025-03-18 |
| 12159821 | Electronic package and manufacturing method thereof | Ting-Yang Chou, Yih-Jenn Jiang | 2024-12-03 |
| 12107055 | Electronic package and fabrication method thereof | Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai | 2024-10-01 |
| 12027484 | Electronic package and carrier thereof and method for manufacturing the same | Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Chang-Fu Lin | 2024-07-02 |
| 11764188 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin | 2023-09-19 |
| 11742296 | Electronic package and manufacturing method thereof | Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin +2 more | 2023-08-29 |
| 11610850 | Electronic package and fabrication method thereof | Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai | 2023-03-21 |
| 11532528 | Electronic package and manufacturing method thereof | Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Chang-Fu Lin | 2022-12-20 |
| 11398429 | Electronic package and manufacturing method thereof | Cheng-Kai Chang, Chang-Fu Lin | 2022-07-26 |
| 10163662 | Fabrication method of semiconductor package | Cheng-Chia Chiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang | 2018-12-25 |
| 10115712 | Electronic module | Shao-Chueh Hu, Yueh-Chiung Chang | 2018-10-30 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Chia-Cheng Chen, Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Wei-Chung Hsiao +1 more | 2017-06-06 |
| 9646921 | Semiconductor package and fabrication method thereof | Cheng-Chia Chiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang | 2017-05-09 |
| 8304665 | Package substrate having landless conductive traces | Chiang-Cheng Chang, Yen-Ping Wang, Jeng-Yuan Lai, Yu-Po Wang | 2012-11-06 |