Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159821 | Electronic package and manufacturing method thereof | Yih-Jenn Jiang, Don-Son Jiang | 2024-12-03 |
| 11973036 | Semiconductor package structure and method of manufacturing the same | — | 2024-04-30 |
| 11121088 | Semiconductor package structure and method of manufacturing the same | — | 2021-09-14 |
| 10637174 | Elastomer structure of conductivity probe | — | 2020-04-28 |