Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11511870 | Parachute device for drone and method for opening parachute thereof | Kuo-Hung Lin | 2022-11-29 |
| 11372779 | Memory controller and memory page management method | Che-Wei Tsao, Tei-Wei Kuo, Yuan-Hao Chang, Shau-Yin Tseng | 2022-06-28 |
| 10141266 | Method of fabricating semiconductor package structure | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-11-27 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-08-07 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-06-19 |
| 9905438 | Method of manufacturing package substrate and semiconductor package | Ming-Chen Sun, Chun-Hsien Lin, Shih-Chao Chiu, Yu-Cheng Pai | 2018-02-27 |
| 9899249 | Fabrication method of coreless packaging substrate | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-02-20 |
| 9785448 | System suspending method, system resuming method and computer system using the same | Kuo-Hung Lin, You-Ching Lin | 2017-10-10 |
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2017-07-25 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Chia-Cheng Chen, Ming-Chen Sun, Shih-Chao Chiu, Wei-Chung Hsiao, Yu-Cheng Pai +1 more | 2017-06-06 |
| 9640503 | Package substrate, semiconductor package and method of manufacturing the same | Ming-Chen Sun, Chun-Hsien Lin, Shih-Chao Chiu, Yu-Cheng Pai | 2017-05-02 |
| 9594572 | Electronic apparatus and method for resuming from hibernation | Kuo-Hung Lin | 2017-03-14 |
| 9510463 | Coreless packaging substrate and fabrication method thereof | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2016-11-29 |