Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12413833 | Vehicle camera | Shuan-Yeong Ju, Ruei-Rong Lin | 2025-09-09 |
| 10939584 | Heat dissipation module and assembly method thereof | Hung-Chan Cheng | 2021-03-02 |
| 10869007 | Event detecting and recording system, management method and activating method for information capturing device | — | 2020-12-15 |
| 10517192 | Bendable heat plate | — | 2019-12-24 |
| 10462944 | Wave absorbing heat dissipation structure | — | 2019-10-29 |
| 10332567 | Heat dissipation and shockproof structure | — | 2019-06-25 |
| 10141266 | Method of fabricating semiconductor package structure | Yu-Cheng Pai, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-11-27 |
| 10109572 | Method for fabricating package structure | — | 2018-10-23 |
| 10096491 | Method of fabricating a packaging substrate including a carrier having two carrying portions | Yu-Cheng Pai, Chun-Hsien Lin, Ming-Chen Sun, Liang-Yi Hung | 2018-10-09 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Yu-Cheng Pai, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-08-07 |
| 10025945 | Decryption method for use in displaying data | — | 2018-07-17 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-06-19 |
| 9899249 | Fabrication method of coreless packaging substrate | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-02-20 |
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-07-25 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Chia-Cheng Chen, Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Yu-Cheng Pai +1 more | 2017-06-06 |
| 9564390 | Package structure and fabrication method thereof | — | 2017-02-07 |
| 9510463 | Coreless packaging substrate and fabrication method thereof | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2016-11-29 |
| 9490225 | Package structure and fabrication method thereof | Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Shih-Chao Chiu | 2016-11-08 |
| 9112063 | Fabrication method of semiconductor package | Chun-Hsien Lin, Yu-Cheng Pai, Liang-Yi Hung, Ming-Chen Sun, Shao-Tzu Tang +2 more | 2015-08-18 |
| 9086862 | Apparatus and method of protecting electronic apparatus using a temperature-power table for an electronic component under different system and environmental temperatures | — | 2015-07-21 |
| 9026262 | Method, circuit, and electronic device for controlling rotation speed of fan | Chun-Chi Wang | 2015-05-05 |
| 8922999 | Heat dissipating assembly and elastic fastening member thereof | Jeng-Ming Lai, Sheng-Fu Liu, Tsung-Yu Chiu | 2014-12-30 |
| 8796867 | Semiconductor package and fabrication method thereof | Chun-Hsien Lin, Yu-Cheng Pai, Liang-Yi Hung, Ming-Chen Sun, Shao-Tzu Tang +2 more | 2014-08-05 |