Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068535 | Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof | Chih-Hsien Chiu, Wen-Jung Tsai, Ko-Wei Chang, Chia-Chu Lai | 2024-08-20 |
| 11404361 | Method for fabricating package structure having encapsulate sensing chip | Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai | 2022-08-02 |
| 10872847 | Package structure and method for fabricating the same | Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai | 2020-12-22 |
| 10224243 | Method of fabricating electronic package | Chang-Yi Lan, Ying-Chou Tsai | 2019-03-05 |
| 10201090 | Fabrication method of circuit structure | Ying-Chou Tsai | 2019-02-05 |
| 9991197 | Fabrication method of semiconductor package | Chia-Cheng Chen, Chi-Ching Ho, Yu Liu, Ying-Chou Tsai | 2018-06-05 |
| 9978673 | Package structure and method for fabricating the same | Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang, Ying-Chou Tsai | 2018-05-22 |
| 9805979 | Electronic package and fabrication method thereof | Chang-Yi Lan, Ying-Chou Tsai | 2017-10-31 |
| 9699910 | Circuit structure and fabrication method thereof | Ying-Chou Tsai | 2017-07-04 |
| 9362217 | Package on package structure and fabrication method thereof | Pang-Chun Lin, Wei Wang, Chun-Yuan Li, Ying-Chou Tsai | 2016-06-07 |
| 9265154 | Packaging substrate and fabrication method thereof | Chi-Ching Ho, Ying-Chou Tsai | 2016-02-16 |
| 9112063 | Fabrication method of semiconductor package | Wei-Chung Hsiao, Chun-Hsien Lin, Yu-Cheng Pai, Liang-Yi Hung, Ming-Chen Sun +2 more | 2015-08-18 |
| 8796867 | Semiconductor package and fabrication method thereof | Wei-Chung Hsiao, Chun-Hsien Lin, Yu-Cheng Pai, Liang-Yi Hung, Ming-Chen Sun +2 more | 2014-08-05 |
| 6433176 | Method for making 8-hydroxyjulolidine compound | Chao-Tsen Chen, Ling Lu, Jim-Min Fang | 2002-08-13 |