Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404361 | Method for fabricating package structure having encapsulate sensing chip | Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen | 2022-08-02 |
| 11114393 | Electronic package and method for fabricating the same | Wen-Jung Tsai, Ching-Chia Chen | 2021-09-07 |
| 10872847 | Package structure and method for fabricating the same | Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen | 2020-12-22 |
| 10833394 | Electronic package and method for fabricating the same | Wen-Jung Tsai, Mao-Hua Yeh, Chih-Hsien Chiu, Chun-Chi Ke | 2020-11-10 |
| 10224243 | Method of fabricating electronic package | Shao-Tzu Tang, Chang-Yi Lan | 2019-03-05 |
| 10201090 | Fabrication method of circuit structure | Shao-Tzu Tang | 2019-02-05 |
| 9991197 | Fabrication method of semiconductor package | Chia-Cheng Chen, Chi-Ching Ho, Shao-Tzu Tang, Yu Liu | 2018-06-05 |
| 9978673 | Package structure and method for fabricating the same | Shao-Tzu Tang, Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang | 2018-05-22 |
| 9899235 | Fabrication method of packaging substrate | Chi-Ching Ho, Sheng-Che Huang | 2018-02-20 |
| 9805979 | Electronic package and fabrication method thereof | Shao-Tzu Tang, Chang-Yi Lan | 2017-10-31 |
| 9699910 | Circuit structure and fabrication method thereof | Shao-Tzu Tang | 2017-07-04 |
| 9362217 | Package on package structure and fabrication method thereof | Pang-Chun Lin, Wei Wang, Chun-Yuan Li, Shao-Tzu Tang | 2016-06-07 |
| 9265154 | Packaging substrate and fabrication method thereof | Shao-Tzu Tang, Chi-Ching Ho | 2016-02-16 |
| 9165789 | Fabrication method of packaging substrate | Chi-Ching Ho, Yu-Chih Yu | 2015-10-20 |
| 9112063 | Fabrication method of semiconductor package | Wei-Chung Hsiao, Chun-Hsien Lin, Yu-Cheng Pai, Liang-Yi Hung, Ming-Chen Sun +2 more | 2015-08-18 |
| 9006039 | Fabrication method of packaging substrate, and fabrication method of semiconductor package | Chi-Ching Ho, Yu-Chih Yu | 2015-04-14 |
| 8810045 | Packaging substrate and semiconductor package | Chi-Ching Ho, Yu-Chih Yu | 2014-08-19 |
| 8796867 | Semiconductor package and fabrication method thereof | Wei-Chung Hsiao, Chun-Hsien Lin, Yu-Cheng Pai, Liang-Yi Hung, Ming-Chen Sun +2 more | 2014-08-05 |
| 6787918 | Substrate structure of flip chip package | Han-Ping Pu, Shih-Kuang Chiu | 2004-09-07 |
| 6772512 | Method of fabricating a flip-chip ball-grid-array package without causing mold flash | Jen-Yi Tsai | 2004-08-10 |
| 6600232 | Flip-chip semiconductor package structure and process for fabricating the same | Shih-Kuang Chiu | 2003-07-29 |
| 6573610 | Substrate of semiconductor package for flip chip package | — | 2003-06-03 |
| 6498054 | Method of underfilling a flip-chip semiconductor device | Shih-Kuang Chiu, Han-Ping Pu | 2002-12-24 |
| 6489180 | Flip-chip packaging process utilizing no-flow underfill technique | Shih-Kuang Chiu | 2002-12-03 |
| 6404064 | Flip-chip bonding structure on substrate for flip-chip package application | Shih-Kuang Chiu, Kuo-Liang Mao, Chao-Dung Suo | 2002-06-11 |