Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6772512 | Method of fabricating a flip-chip ball-grid-array package without causing mold flash | Ying-Chou Tsai | 2004-08-10 |
| 6359342 | Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same | Pao-Ho Yuan, Ting-Ke Chai, Lien-Chi Chan | 2002-03-19 |