Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7339280 | Semiconductor package with lead frame as chip carrier and method for fabricating the same | Jui-Yu Chuang, Chih-Ming Huang | 2008-03-04 |
| D529031 | IC card type circuit module | Chih-Ming Huang, Chien-Ping Huang, Jui-Yu Chuang, Cheng-Hsu Hsiao | 2006-09-26 |
| 6858931 | Heat sink with collapse structure for semiconductor package | Chien-Ping Huang, Chi-Chuan Wu, Jui-Yu Chuang | 2005-02-22 |
| 6847104 | Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same | Chien-Ping Huang, Chih-Ming Huang, Jui-Yu Chuang | 2005-01-25 |
| D492314 | IC card type circuit module | Chih-Ming Huang, Chien-Ping Huang, Jui-Yu Chuang, Cheng-Hsu Hsiao | 2004-06-29 |
| 6538321 | Heat sink with collapse structure and semiconductor package with heat sink | Chien-Ping Huang, Chi-Chuan Wu, Jui-Yu Chuang | 2003-03-25 |
| 6359342 | Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same | Pao-Ho Yuan, Ting-Ke Chai, Jen-Yi Tsai | 2002-03-19 |