Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404361 | Method for fabricating package structure having encapsulate sensing chip | Shao-Tzu Tang, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai | 2022-08-02 |
| 10872847 | Package structure and method for fabricating the same | Shao-Tzu Tang, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai | 2020-12-22 |
| 9978673 | Package structure and method for fabricating the same | Shao-Tzu Tang, Chien-Hui Wang, Chung-Yan Huang, Ying-Chou Tsai | 2018-05-22 |