Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009340 | Method for fabricating electronic package | Lung-Yuan Wang, Feng Kao | 2024-06-11 |
| 11747382 | Test equipment and test device thereof | Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim | 2023-09-05 |
| 11152331 | Electronic package and method for fabricating the same | Lung-Yuan Wang, Feng Kao | 2021-10-19 |
| 11081415 | Method for manufacturing electronic package | Chieh-Lung Lai, Cheng-Yi Chen, Chun-Hung Lu | 2021-08-03 |
| 10833394 | Electronic package and method for fabricating the same | Wen-Jung Tsai, Chih-Hsien Chiu, Ying-Chou Tsai, Chun-Chi Ke | 2020-11-10 |
| 10679914 | Electronic package and method for manufacturing the same | Chieh-Lung Lai, Cheng-Yi Chen, Chun-Hung Lu | 2020-06-09 |
| 9899308 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Yi-Che Lai, Shih-Kuang Chiu | 2018-02-20 |
| 9831191 | Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package | Chieh-Lung Lai, Hung-Yuan Li, Shih-Liang Peng, Chang-Lun Lu | 2017-11-28 |
| 9666536 | Package structure and fabrication method thereof | Yi-Wei Liu, Yan-Heng Chen, Hung-Wen Liu, Yi-Che Lai | 2017-05-30 |
| 9607939 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Yi-Che Lai, Shih-Kuang Chiu | 2017-03-28 |
| 9502335 | Package structure and method for fabricating the same | Chieh-Lung Lai, Hsien-Wen Chen, Hong-Da Chang | 2016-11-22 |
| 7968991 | Stacked package module and board having exposed ends | Lin-Yin Wong, Wang-Hsiang Tsai | 2011-06-28 |
| 7656015 | Packaging substrate having heat-dissipating structure | Lin-Yin Wong | 2010-02-02 |