Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107055 | Electronic package and fabrication method thereof | Chih-Hsun Hsu, Chi-Jen Chen, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang | 2024-10-01 |
| 11610850 | Electronic package and fabrication method thereof | Chih-Hsun Hsu, Chi-Jen Chen, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang | 2023-03-21 |
| 11600571 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hong-Da Chang | 2023-03-07 |
| 11532528 | Electronic package and manufacturing method thereof | Chi-Jen Chen, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang | 2022-12-20 |
| 10903167 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hong-Da Chang | 2021-01-26 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Shih-Ching Chen, Yi-Che Lai, Hong-Da Chang, Hung-Wen Liu +1 more | 2017-03-28 |
| 9397081 | Fabrication method of semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi | 2016-07-19 |
| 9177859 | Semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi | 2015-11-03 |
| 9040361 | Chip scale package with electronic component received in encapsulant, and fabrication method thereof | Chiang-Cheng Chang, Chien-Ping Huang, Chun-Chi Ke, Hsin-Yi Liao | 2015-05-26 |
| 8828796 | Semiconductor package and method of manufacturing the same | Chieh-Yuan Chi, Wei-Yu Chen, Hung-Wen Liu, Yan-Heng Chen | 2014-09-09 |
| 8766456 | Method of fabricating a semiconductor package | Hsin-Hung Chou, Hung-Wen Liu, Hsin-Yi Liao, Chiang-Cheng Chang | 2014-07-01 |