Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403567 | Fabrication method of electronic package | Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan | 2019-09-03 |
| 9899303 | Electronic package and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan | 2018-02-20 |
| 9842758 | Package structure and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin | 2017-12-12 |
| 9768140 | Method for fabricating package structure | Yan-Heng Chen, Mu-Hsuan Chan | 2017-09-19 |
| 9607941 | Conductive via structure and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan | 2017-03-28 |
| 9548219 | Semiconductor package and fabrication method thereof and carrier structure | Yan-Heng Chen, Chung-Tang Lin | 2017-01-17 |
| 9515040 | Package structure and fabrication method thereof | Yan-Heng Chen, Mu-Hsuan Chan, Chun-Tang Lin | 2016-12-06 |
| 9397081 | Fabrication method of semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Hsi-Chang Hsu | 2016-07-19 |
| 9337061 | Fabrication method of semiconductor package | Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan, Yan-Yi Liao | 2016-05-10 |
| 9224646 | Method for fabricating semiconductor package | Yan-Heng Chen, Chun-Tang Lin, Hung-Wen Liu | 2015-12-29 |
| 9177859 | Semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Hsi-Chang Hsu | 2015-11-03 |
| 8828796 | Semiconductor package and method of manufacturing the same | Wei-Yu Chen, Hung-Wen Liu, Yan-Heng Chen, Hsi-Chang Hsu | 2014-09-09 |