Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414232 | Substrate structure | Fang-Lin Tsai, Wei-Son TSAI, Yih-Jenn Jiang | 2025-09-09 |
| 12255165 | Electronic package and carrier thereof and method for manufacturing the same | Chi-Ren Chen, Po-Yung Chang, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang | 2025-03-18 |
| 12027484 | Electronic package and carrier thereof and method for manufacturing the same | Chi-Ren Chen, Po-Yung Chang, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang | 2024-07-02 |
| 11791300 | Electronic package and circuit structure thereof | Fang-Lin Tsai, Chia-Yu Kuo, Wei-Son TSAI, Yih-Jenn Jiang | 2023-10-17 |